Thermal conductive silicone pad
* Thermal Conductivity: 1.5 ~ 15.0W/mK
* Sesebelisoa sa Compression e tlase
* Ho bonolo ho kopanya le ho sebelisoa hape
* Mamello e phahameng ea Mocheso
* Karohano e ntle ea motlakase
* Mahlakore a mabeli ka mokhoa oa tlhaho oa tlhaho
* Flat panel TV, lisebelisoa tsa mohala, hard disk drive ea lebelo le holimo
* Lisebelisoa tsa ka tlung, ponts'o ea LCD
* Pakete ea betri bakeng sa likoloi tse ncha tsa motlakase / libese
* Khomphuta, seva sa PC, setsi sa mosebetsi
* Leseli la LED, lisebelisoa tsa mabone
* Pakeng tsa semiconductor le sink ea mocheso, li-processor ho lisinki tsa mocheso, GPU ho siling ea mocheso
* Karolo ea chip le chip
* Mokhanni oa HDDVD IC
* Phetoho ea matla
* Litaolo tsa enjene ea likoloi / li-trans mission
* GPU VRAM
* Likoloi tse ngata tsa polokelo
* Mojule oa LCD oa khanya ea morao
* Thepa ea puisano ea marang-rang
| Thepa | Yuniti | TS150 | TS200 | TS250 | TS300 | TS350 | TS400 |
| Botenya | mm | 0.20~10.0 | 0.20~10.0 | 0.20~10.0 | 0.30 ~ 10.0 | 0.30 ~ 10.0 | 0.30 ~ 10.0 |
| Mmala | - | Boputsoa/Boputsoa | Boputsoa/Boputsoa | Boputsoa/Boputsoa | Boputsoa/Boputsoa | Boputsoa/ Bopherese | Boputsoa/ Bopherese |
| Ho thatafala | sc | 10-60 | 10-60 | 20-60 | 20-60 | 20-60 | 20-60 |
| Thermal Conductivity | W/m·k | 1.5 | 2.2 | 2.5 | 3.1 | 3.6 | 4.1 |
| Ho hanyetsa Mollo | UL-94 | V0 | V0 | V0 | V0 | V0 | V0 |
| Matla a Motlakase | Kv/mm | >6.5 | >6.5 | >6.5 | >6.5 | >6.5 | >6.5 |
| Matla a tšepe | MPa | 0.1 | 0.1 | 0.1 | 0.5 | 0.134 | 0.134 |
| Matla a Kgapha | N/MM | 1.5 | 1.5 | 1.5 | 0.4 | 0.279 | 0.279 |
| Botenya | g/cm3 | 2.5 | 2.5 | 2.6 | 2.8 | 3.0 | 3.3 |
| Ho Adhesion ka Bokaholimo | Ball ea tšepe | >10# | >10# | >10# | >10# | >10# | >10# |
| Ho Hanyetsa Molumo | mΩ/m | 1*10^13 | 1*10^13 | 1*10^13 | 1*10^13 | 1*10^13 | 1*10^13 |
| Bokaholimo ba Resistance | Ω | 1*10^12 | 1*10^12 | 1*10^12 | 1*10^12 | 1*10^12 | 1*10^12 |
| Mocheso oa Mosebetsi | ℃ | - 40-200 | - 40-200 | - 40-200 | - 40-200 | - 40-200 | - 40-200 |
| Siloxane Content | ppm | <500 | <500 | <500 | <500 | <500 | <500 |
| Elongation | % | 50% | 50% | 50% | 50% | 50% | 50% |
|
| |||||||
| Thepa | Yuniti | TS500 | TS600 | TS700 | TS800 | TS1000 | TS1300 |
| Botenya | mm | 0.30 ~ 10.0 | 0.80~10.0 | 0.80~10.0 | 0.80~10.0 | 1.0~10.0 | 0.8~10.0 |
| Mmala | - | Hlooho | Hlooho | Hlooho | Hlooho | Boputsoa/Boputsoa | Hlooho |
| Ho thatafala | sc | 20-60 | 20-60 | 30-60 | 30-60 | 10-60 | 30-60 |
| Thermal Conductivity | W/m·k | 5 | 6.1 | 7 | 8 | 10 | 13 |
| Ho hanyetsa Mollo | UL-94 | V0 | V0 | V0 | V0 | V0 | V0 |
| Matla a Motlakase | Kv/mm | >6.5 | >6.5 | >6.5 | >6.5 | >6.5 | >6.5 |
| Matla a tšepe | MPa | 0.091 | 0.091 | 0.1 | 0.085 | 0.07 | 0.065 |
| Matla a Kgapha | N/MM | 0.49 | 0.45 | 0.8 | 0.35 | 0.3 | 0.28 |
| Botenya | g/cm3 | 3.2 | 3.3 | 3.3 | 3.5 | 3.5 | 3.3 |
| Ho Adhesion ka Bokaholimo | Ball ea tšepe | >10# | >10# | >10# | >10# | >10# | 7# |
| Ho Hanyetsa Molumo | mΩ/m | 1*10^13 | 1*10^13 | 1*10^13 | 1*10^13 | 1*10^13 | 1*10^13 |
| Bokaholimo ba Resistance | Ω | 1*10^12 | 1*10^12 | 1*10^12 | 1*10^12 | 1*10^12 | 1*10^12 |
| Mocheso oa Mosebetsi | ℃ | - 40-200 | - 40-200 | - 40-200 | - 40-200 | - 40-200 | - 40-200 |
| Siloxane Content | ppm | <500 | <500 | <500 | <500 | <500 | <5000 |
| Elongation | % | 50% | 50% | 50% | 50% | 50% | 50% |
| Sebaka sa Tšimoloho | China |
| Setifikeiti | UL, REACH, ROHS, ISO 9001, ISO 16949 |
| Sephetho sa Letsatsi le Letsatsi | 5 lithane |
| Bonyane Bongata ba Order | 1000 likhomphutha |
| Theko (USd) | 0.05 |
| Lintlha tsa Sephutheloana | Tloaelehileng Export Packaging |
| Matla a Phepelo | 100000m² |
| Portal Port | Shanghai |
