G10 Insulating Glass Epoxy Laminate
kamehla botenya: 0.5 ~ 100mm
Boholo ba kamehla: 1020 × 2040mm
Lesela la fiber ea khalase e se nang alkali ea elektronike le kenngoe ka resin ea epoxy e tsoang kantle ho naha, 'me e eketsoa ka li-retardants tsa lelakabe tse tsoang kantle ho naha, likhomaretsi le li-additives tse ling, ebe li sebetsoa ka ho tobetsa ho chesang.Kereiti ea UL94-VO e thibelang malakabe, thepa e ntle ea mochini mochesong o phahameng, ts'ebetso e ntle ea ts'ebetso le ts'ebetso ea insulation.
Sesebelisoa sa G10 epoxy board: se sebelisoa e le likarolo tsa meralo ea li-motor le lisebelisoa tsa motlakase, joalo ka li-circuit breaker, switch cabinets, transformer, DC motors, AC contactors, lisebelisoa tsa motlakase tse thibelang ho phatloha le lisebelisoa tse ling tsa motlakase.
Che. | Lintho | Yuniti | Boleng bo Tloaelehileng | Sephetho sa teko |
1 | Flexural matla perpendicular to laminations | MPa | GB/T1303.4-2009 | ≥340 |
2 | Ho kobeha modulus elastic | MPa | GB/T1303.4-2009 | / |
3 | Notch Impact matla a tsamaisanang le lamination (charpy) | kJ/m2 | GB/T1303.4-2009 | ≥33 |
4 | Matla a tšepe | MPa | GB/T1303.4-2009 | / |
5 | Matla a dielectric perpendicular to laminations (ka oli 20±2℃) | KV/mm | GB/T1303.4-2009 | ≥11.4 |
6 | Matla a ho senyae bapileng le lamination (ka oli90±2℃) | KV | GB/T1303.4-2009 | ≥35 |
7 | 1 MHz ntlha ea tahlehelo | / | GB/T1303.4-2009 | / |
8 | Insulation resistance e kentsoeng ka metsing | MΩ | GB/T1303.4-2009 | ≥5x10000 |
9 | CTI | / | GB/T 4207-2012 | / |
10 | Ho monya metsi | mg | GB/T 1303.4-2009 | ≤27 |
11 | Botenya | g/cm3 | GB/T 1303.4-2009 | / |